| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc4vlx40-11ffg668i | Virtex-4 LX | 4.608,00 | -11,00 | 41472 | 1769472 | 448 | 1.14 فولت ~ 1.26 فولت | التركيب على السطح | -40 °C ~ +100 °C (Industrial) | 668-BBGA (FCBGA) | 668-FCBGA |
XC4VLX40-11FFG668I: High-Speed Industrial FPGA for Mission-Critical Logic
إن xc4vlx40-11ffg668i is a high-performance, industrial-grade member of the Xilinx Virtex®-4 LX family. It is specifically binned for the -11 speed grade, providing the fastest logic switching and tighter timing margins required for high-frequency digital signal processing. Engineered on the 90nm ASMBL™ architecture, this FPGA delivers a robust balance of 41k logic cells and versatile I/O capabilities, all within a ruggedized Industrial Temperature (-40°C to +100°C) envelope.
For hardware engineers, the “11I” combination is the gold standard for applications where timing closure is difficult and the operating environment is unpredictable.
Engineering Core Features
Premium Speed Grade (-11): Provides enhanced frequency headroom, allowing for more complex logic levels between clock edges. This is critical for stabilizing 300MHz+ internal data paths.
Industrial Thermal Resilience: Rated for -40°C to +100°C Tj. Unlike commercial parts, this device maintains its timing specifications across extreme temperature fluctuations, making it essential for outdoor infrastructure and heavy industrial control.
Advanced Memory & DSP Integration: Equipped with 1,728 Kb of Block RAM و 64 dedicated XtremeDSP™ slices. The DSP48 blocks allow for efficient, hard-coded arithmetic acceleration without consuming standard logic gates.
High-Density SelectIO™: إن FFG668 package breaks out 448 User I/Os, supporting a vast range of signaling standards (LVDS, HSTL, SSTL). The Flip-Chip (FFG) design ensures low-inductance paths, significantly reducing ground bounce and EMI.
Lead-Free RoHS Compliance: إن “FFG” designation ensures the device meets all modern environmental regulations for global distribution without sacrificing thermal performance.
Technical Specification Matrix
| الميزة | المواصفات |
| الخلايا المنطقية | 41,472 |
| Total Block RAM | 1,728 Kb |
| DSP48 Slices | 64 |
| User I/Os | 448 |
| درجة السرعة | -11 (High-Performance) |
| Temperature Grade | صناعي (-40 درجة مئوية إلى +100 درجة مئوية) |
| الحزمة | FFG668 (Lead-Free Flip-Chip BGA) |
| الجهد الأساسي | 1.2V |
Why Specify the LX40-11I?
1. Precision Timing Under Load
In complex RTL designs, routing congestion often eats into your timing budget. The -11 speed grade provides the necessary slack to ensure your design hits 200MHz-350MHz clock targets even at high logic utilization levels.
2. Thermal Stability for Long-Lifecycle Projects
Industrial systems often face “hot spots” within enclosures. Selecting the صناعي (-I) grade provides an extra 15°C of safety margin over commercial parts, preventing thermal-induced logic errors and extending the Mean Time Between Failures (MTBF) of your end product.
3. Optimized Footprint for Multi-Interface Bridging
The FFG668 package strikes an excellent balance between pin-count and PCB routing complexity. It is large enough to handle wide DDR2 or QDR memory interfaces but compact enough for high-density line cards and modular industrial controllers.
التطبيقات المستهدفة
Aerospace & Defense: Ruggedized communication bridges and telemetry systems.
Energy & Grid: Real-time power monitoring and high-speed protection relays.
Automated Test Equipment (ATE): High-speed pin electronics and pattern generators.
Telecommunications: Small cell base stations and outdoor backhaul equipment.
