| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc4vlx200-11ffg1513i | Virtex-4 LX | 22.272,00 | -11,00 | 200448 | 6193152 | 960 | 1.14 فولت ~ 1.26 فولت | التركيب على السطح | -40 °C ~ +100 °C (Industrial) | 1513-BBGA (FCBGA) | 1513-FCBGA |
XC4VLX200-11FFG1513I: Ultra-High Density FPGA for Mission-Critical Industrial Systems
إن xc4vlx200-11ffg1513i represents the maximum logic capacity and highest performance tier within the Xilinx Virtex®-4 LX family. Combining a massive 200,448 Logic Cells with the superior -11 speed grade و Industrial temperature rating, this device is specifically engineered for architects who require zero-compromise logic density and timing precision in harsh environments.
Housed in the 1513-pin Flip-Chip BGA package, it offers the highest I/O count in its class, making it the premier choice for large-scale system integration and high-bandwidth data processing.
Core Engineering Advantages
Peak Logic Capacity: With over 200k Logic Cells, the LX200 is the ultimate “System-on-Chip” platform for the Virtex-4 generation, capable of hosting multiple complex IP cores, soft processors (MicroBlaze), and massive custom RTL logic without routing bottlenecks.
High-Speed Timing (-11 Speed Grade): The -11 grade provides critical timing headroom over the standard -10 models. It is essential for achieving timing closure in designs running 300MHz+ internal fabric speeds or high-speed memory interfaces.
Massive On-Chip Memory: الميزات 6,048 Kb of Block RAM, enabling deep data buffering for high-throughput networking packets or high-resolution video frames without the latency of external memory.
Industrial-Grade Reliability: Rated for junction temperatures from -40°C to +100°C, ensuring long-term stability for outdoor telecommunications, aerospace ground equipment, and heavy industrial automation.
Lead-Free High-Density Package (FFG1513): The RoHS-compliant Flip-Chip BGA package features an optimized pin-out for signal integrity, minimizing Simultaneous Switching Noise (SSN) even when driving hundreds of I/Os simultaneously.
Technical Specification Matrix
| Metric | المواصفات |
| الخلايا المنطقية | 200,448 |
| Total Block RAM | 6,048 Kb |
| DSP48 Slices | 96 |
| User I/Os | 960 |
| درجة السرعة | -11 (High Performance) |
| Temperature Grade | صناعي (-40 درجة مئوية إلى +100 درجة مئوية) |
| نوع الحزمة | FFG1513 (Lead-Free Flip-Chip BGA) |
| تكنولوجيا المعالجة | 90nm ASMBL™ Architecture |
Why Source the LX200-11I?
1. Scalability Without Compromise
The LX200 is often the designated choice for high-end “legacy-plus” systems. If your design has outgrown the LX160, the LX200 provides a seamless migration path within the same architecture, offering nearly 25% more logic resources.
2. Signal Integrity at Scale
With 960 available User I/Os, the FF1513 package is a masterpiece of signal integrity engineering. It provides enough ground and power pins to support wide, high-speed parallel buses while maintaining a clean EMI profile—a critical factor for industrial certifications.
3. Timing Headroom in Saturated Designs
As FPGA utilization exceeds 80%, routing delays typically increase. The -11 speed grade mitigates this “congestion penalty,” giving designers the extra nanoseconds needed to meet setup and hold requirements in highly congested layouts.
Primary Applications
Defense & Signal Intelligence: High-bandwidth radar signal processing and electronic warfare systems.
Medical Imaging: Real-time 3D/4D reconstruction in MRI and CT scanners.
Communications: 10G/40G backplane switching and high-speed protocol conversion.
ASIC Prototyping: Large-scale logic verification and hardware-in-the-loop (HIL) simulation.
