| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc4vlx200-10ffg1513i | Virtex-4 LX | 22.272,00 | -10,00 | 200448 | 6193152 | 960 | 1.14 فولت ~ 1.26 فولت | التركيب على السطح | -40 درجة مئوية ~ +100 درجة مئوية (صناعي) | 1513-BBGA (FCCBGA) | 1513-FCBGA |
XC4VLX200-10FFG1513I: The Apex of High-Density Logic & Industrial Reliability
إن xc4vlx200-10ffg1513i represents the maximum logic capacity available in the Xilinx Virtex®-4 LX series. Engineered for massive system integration, this FPGA is designed for architects who need to consolidate complex multi-processor systems, extensive DSP arrays, and high-speed switching fabrics into a single silicon footprint.
As an Industrial-grade (-I) device with a Lead-Free (FFG1513) package, it provides the ultimate combination of environmental resilience and massive I/O throughput.
Engineering Core Capabilities
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Maximum Logic Scale: Boasting a staggering 200,448 خلية منطقية, the LX200 allows for the deployment of multiple heavy-duty IP cores (such as PCIe, Ethernet MACs, and soft-core processors) without reaching routing saturation.
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Superior Memory Density: Features over 6Mbit (6,048 Kb) of Block RAM. This massive on-chip storage is critical for deep packet buffering, high-resolution video frame buffers, and large-scale FFT implementations.
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High-Pin-Count Connectivity: يقع في رقاقة BGA ذات 1513 سنًا ذات الرقاقة القلابة BGA, this device breaks out 960 User I/Os. This allows for the simultaneous management of multiple high-width memory interfaces (DDR2/QDR) and wide parallel system buses.
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Industrial Thermal Range: Specifically binned for -40 درجة مئوية إلى +100 درجة مئوية junction temperature operation. This ensures timing stability and logic integrity in mission-critical environments where active cooling may be limited or ambient temperatures fluctuate.
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Advanced XtremeDSP™ Resources: تشمل 96 شريحة DSP48 DSP48, providing high-performance hardware acceleration for arithmetic-intensive applications like radar signal processing and medical imaging.
مصفوفة المواصفات الفنية
| الميزة | المواصفات |
| الخلايا المنطقية | 200,448 |
| مصفوفة CLB | 22,512 |
| إجمالي كتلة ذاكرة الوصول العشوائي (RAM) | 6,048 كيلو بايت |
| شرائح DSP48 DSP48 | 96 |
| مدخلات/مخرجات المستخدم | 960 |
| درجة السرعة | -10 |
| درجة الحرارة | صناعي (-40 درجة مئوية إلى +100 درجة مئوية) |
| الحزمة | FFG1513 (رقاقة BGA خالية من الرصاص) |
Why Specify the LX200-10FFG1513I?
1. Unmatched Logic Consolidation
If you are moving away from multi-FPGA boards to a single-chip solution, the LX200 is the industry standard for Virtex-4 designs. The massive logic-to-I/O ratio eliminates the latency penalties and board complexity associated with inter-FPGA communication.
2. Robust Signal Integrity
إن FFG1513 package is engineered with a high density of power and ground pins to mitigate Simultaneous Switching Noise (SSN). Even when toggling hundreds of I/Os at high speeds, the device maintains clean signal eyes and robust noise margins.
3. Long-Term Reliability & Compliance
The “FFG” lead-free designation ensures your product meets modern RoHS compliance while the “Industrial” rating provides the necessary overhead for long-lifecycle deployment in telecommunications backbones and ruggedized control systems.
High-Value Applications
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الاتصالات: 10G/40G networking line cards and base station processing.
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الدفاع والفضاء: Radar beamforming, UAV signal processing, and secure communication.
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Scientific Computing: ASIC emulation, hardware-in-the-loop (HIL) testing, and genomic sequencing acceleration.
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Medical: Real-time 3D reconstruction for CT and MRI systems.
