ADXL355BEZ ADXL355BEZ

This is a hermetically sealed high-performance 3-axis digital MEMS accelerometer manufactured by Analog Devices, designed for precision tilt measurement, structural vibration monitoring and inertial attitude sensing scenarios demanding ultra-low noise and excellent long-term stability.

ADXL355 stands for high-stability digital triaxial acceleration sensor series. BEZ refers to hermetic metal sealed 14-pin LCC industrial packaging version without tape reel packaging configuration, delivered in standard tray packing for prototype development and batch production assembly.

Three optional programmable acceleration measurement ranges: ±2.048g, ±4.096g, ±8.192g, equipped with built-in 20-bit high-resolution ADC digital output. Ultra-low noise density reaches 22.5μg/√Hz across all three axes, maximum zero-g offset temperature drift is limited to 0.15mg/℃, which drastically reduces regular calibration frequency for long-running unattended equipment.

Dual digital communication interfaces including SPI and I2C are integrated inside the chip, supporting synchronous multi-device sampling. Programmable digital high-pass and low-pass filters are embedded to filter ambient electromagnetic interference. It also comes with an on-chip temperature sensor and electromechanical self-test function for routine equipment performance inspection and fault checking.

Supply voltage range covers 2.25V to 3.6V to match mainstream embedded 3.3V power rails. Operating current stays at 200μA under normal measurement mode, while standby current drops to only 21μA, perfectly fitting battery-powered wireless sensor terminals. The maximum internal signal bandwidth can be adjusted up to 1.5kHz to capture high-frequency vibration and shock signals accurately.

It adopts 14-pin hermetic LCC surface mount packaging with overall dimension 6mm × 5.6mm × 2.2mm. The fully sealed metal cavity structure prevents moisture, dust and corrosive gas intrusion, maintaining consistent sensing performance under harsh environmental conditions. Classified as MSL3 moisture sensitive component, all reflow soldering operations must be completed within 168 hours after original vacuum package opening. Standard tray packing is adopted to cooperate with automatic SMT mounting equipment on mass production lines.

Wide continuous operating temperature range spans from -40℃ to +125℃, capable of stable operation inside industrial cabinets, vehicle-mounted electronic systems and outdoor monitoring devices with severe temperature fluctuations. The whole device is produced with lead-free manufacturing technology and complies with global environmental material restriction regulations. Hermetic packaging delivers outstanding anti-aging capability for long-term field application.

Bridge, dam, tower building structural health vibration and displacement monitoring equipment

Inertial measurement units, attitude reference systems and robot balance control modules

Seismic signal acquisition instruments, geological vibration detection and underground pipeline inspection terminals

Industrial equipment vibration fault diagnosis, machine tool spindle condition monitoring nodes

Battery-powered portable testing instruments and wearable motion tracking devices

LXB Semicon supplies original Analog Devices ADXL355BEZ sealed triaxial high-precision digital accelerometer IC