| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ADSP-21469KBCZ-4 | ADSP-21469 (عائلة SHARC) | 0,00 | 450,00 | غير متاح | 500000 | 0 | القضبان الأساسية/قضبان الإدخال والإخراج حسب ورقة البيانات | التركيب على السطح | 0 درجة مئوية إلى +70 درجة مئوية | 324-كرة CSP / 324-BGA 324-BGA | BC-324-1 (324-Ball CSP_BGA) |
ADSP-21469KBCZ-4
الشركة المصنعة: الأجهزة التناظرية
الخلايا المنطقية: бк
شرائح المنطق: бк
ذاكرة الوصول العشوائي المدمجة (eRAM): 5 ميغابايت على الرقاقة SRAM على الرقاقة
الحزمة: SABP
درجة حرارة التشغيل: من 40 درجة مئوية إلى +85 درجة مئوية
المواصفات
تعريف رقم القطعة
ADSP-21469 is a single-core 32/40-bit floating-point SHARC digital signal processor built on Super Harvard Architecture, specially optimized for high-precision audio and real-time signal computing.
KBCZ stands for industrial temperature specification, lead-free packaging and 324-ball CSPBGA form factor. The suffix digit 4 represents the maximum core operating frequency of 450 MHz. Components are shipped in anti-static tray packaging for automated PCB assembly.
المعلمات الأساسية لأداء النظام الكهربائي
Main Computing Specifications
- Core clock frequency: 450 MHz, supporting SIMD parallel instruction execution
- Arithmetic formats: 32-bit single-precision floating point, 40-bit extended floating point, plus 8/16/32-bit fixed-point arithmetic
- Integrated dedicated hardware accelerators for FFT, FIR and IIR digital filtering to drastically shorten algorithm runtime
- Full source code compatibility with all legacy SHARC series DSP chips
On-Chip Memory
Total on-chip SRAM reaches 5 Mbits, flexibly partitionable as program memory and data memory to ease buffering for continuous audio streaming and signal acquisition tasks. Multiple independent internal buses eliminate internal data transmission bottlenecks.
Built-In Peripheral Resources
- Digital Application Interface (DAI): fully configurable peripheral routing module, compatible with I2S, TDM, SPDIF and 8-channel asynchronous sample rate converters
- 8 multi-function serial port units (SPORTs) for audio codec connection
- Two high-speed Link Ports for multi-DSP cascading and point-to-point high-speed data exchange
- Dual SPI ports, 1 UART, I2C bus, 16-channel PWM outputs and three programmable hardware timers
- Embedded 16-bit DDR2 external memory controller for expanding large-capacity off-chip storage
- Advanced multi-channel DMA controller supporting scatter-gather and delay-line DMA, handling background data transmission without occupying core resources
- Standard IEEE 1149.1 JTAG debug interface for program download and system troubleshooting
Power Supply Parameters
- Core digital supply voltage: 1.1 V typical range (1.05 V ~ 1.15 V)
- Analog and I/O interface supply voltage: 3.3 V
- No internal non-volatile flash memory; firmware needs to be loaded from external storage after power-up
مواصفات التعبئة والتجميع
Encapsulated in 324-pin CSPBGA surface-mount package with overall dimensions 19 mm × 19 mm. Compact outline fits neatly into professional audio equipment and portable precision instrument mainboards with limited internal space.
Moisture Sensitivity Level is MSL3. All reflow soldering operations must be completed within 168 hours once the vacuum sealed packaging is opened. Tray packaging is adopted for mass industrial electronic production.
المعايير البيئية ومعايير الامتثال
Continuous stable operation is guaranteed within the industrial temperature range of -40°C to +85°C, adapting to indoor audio devices, medical imaging equipment and field test instruments under varying ambient temperatures and electromagnetic interference environments.
Manufactured with lead-free semiconductor processes, the device fully complies with global RoHS environmental regulations, and remains active in official production supply.
مجالات التطبيق النموذجية
Professional studio audio mixing consoles, multi-channel audio effect processing systems
Medical ultrasonic diagnostic equipment real-time sound and image signal calculation units
High-precision audio analyzers, spectrum measurement and acoustic testing instruments
Industrial vibration monitoring, noise acquisition and fault diagnosis embedded systems
On-board vehicle audio processing, public broadcasting multi-channel digital audio matrix equipment
