{"id":6683,"date":"2025-11-18T20:08:40","date_gmt":"2025-11-18T12:08:40","guid":{"rendered":"https:\/\/www.lxbchip.com\/?post_type=product&p=6683"},"modified":"2026-02-02T19:10:21","modified_gmt":"2026-02-02T11:10:21","slug":"xc4vlx200-10ffg1513i","status":"publish","type":"product","link":"https:\/\/www.lxbchip.com\/vi\/products\/xc4vlx200-10ffg1513i\/","title":{"rendered":"XC4VLX200-10FFG1513I"},"content":{"rendered":"\n\n\n\n\n
M\u00c3 S\u1ea2N PH\u1ea8M<\/th>\nB\u1ed8 PHIM<\/th>\nS\u1ed0 L\u01af\u1ee2NG PH\u00d2NG TH\u00cd NGHI\u1ec6M\/CLBS<\/th>\n\u0110\u1ed8 B\u1ec0N THEO T\u1ed0C \u0110\u1ed8<\/th>\nS\u1ed0 L\u01af\u1ee2NG PH\u1ea6N T\u1eec L\u1ed0I \/ T\u1ebe B\u00c0O<\/th>\nT\u1ed5ng s\u1ed1 bit RAM<\/th>\nS\u1ed0 L\u01af\u1ee2NG I\/O<\/th>\n\u0110i\u1ec7n \u00e1p \u2013 Ngu\u1ed3n c\u1ea5p<\/th>\nLo\u1ea1i l\u1eafp \u0111\u1eb7t<\/th>\nNHI\u1ec6T \u0110\u1ed8 HO\u1ea0T \u0110\u1ed8NG<\/th>\nG\u00d3I \/ H\u1ed8P<\/th>\nG\u00d3I THI\u1ebeT B\u1eca C\u1ee6A NH\u00c0 CUNG C\u1ea4P<\/th>\n<\/tr>\n<\/thead>\n
XC4VLX200-10FFG1513I<\/td>\nVirtex-4 LX<\/td>\n22.272,00<\/td>\n-10,00<\/td>\n200448<\/td>\n6193152<\/td>\n960<\/td>\n1,14 V ~ 1,26 V<\/td>\nL\u1eafp \u0111\u1eb7t b\u1ec1 m\u1eb7t<\/td>\n-40 \u00b0C ~ +100 \u00b0C (C\u00f4ng nghi\u1ec7p)<\/td>\n1513-BBGA (FCBGA)<\/td>\n1513-FCBGA<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

XC4VLX200-10FFG1513I: The Apex of High-Density Logic & Industrial Reliability<\/b><\/p>\n

The XC4VLX200-10FFG1513I<\/b> represents the maximum logic capacity available in the Xilinx Virtex\u00ae-4 LX series. Engineered for massive system integration, this FPGA is designed for architects who need to consolidate complex multi-processor systems, extensive DSP arrays, and high-speed switching fabrics into a single silicon footprint.<\/p>\n

As an Industrial-grade (-I)<\/b> device with a Lead-Free (FFG1513)<\/b> package, it provides the ultimate combination of environmental resilience and massive I\/O throughput.<\/p>\n

Engineering Core Capabilities<\/b><\/span><\/p>\n

    \n
  • \n

    Maximum Logic Scale:<\/b> Boasting a staggering 200,448 Logic Cells<\/b>, the LX200 allows for the deployment of multiple heavy-duty IP cores (such as PCIe, Ethernet MACs, and soft-core processors) without reaching routing saturation.<\/p>\n<\/li>\n

  • \n

    Superior Memory Density:<\/b> Features over 6Mbit (6,048 Kb) of Block RAM<\/b>. This massive on-chip storage is critical for deep packet buffering, high-resolution video frame buffers, and large-scale FFT implementations.<\/p>\n<\/li>\n

  • \n

    High-Pin-Count Connectivity:<\/b> Housed in the 1513-pin Flip-Chip BGA<\/b>, this device breaks out 960 User I\/Os<\/b>. This allows for the simultaneous management of multiple high-width memory interfaces (DDR2\/QDR) and wide parallel system buses.<\/p>\n<\/li>\n

  • \n

    Industrial Thermal Range:<\/b> Specifically binned for -40\u00b0C to +100\u00b0C<\/b> junction temperature operation. This ensures timing stability and logic integrity in mission-critical environments where active cooling may be limited or ambient temperatures fluctuate.<\/p>\n<\/li>\n

  • \n

    Advanced XtremeDSP\u2122 Resources:<\/b> Includes 96 DSP48 slices<\/b>, providing high-performance hardware acceleration for arithmetic-intensive applications like radar signal processing and medical imaging.<\/p>\n<\/li>\n<\/ul>\n

    \n

    Technical Specification Matrix<\/b><\/span><\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n
    T\u00ednh n\u0103ng<\/strong><\/td>\nTh\u00f4ng s\u1ed1 k\u1ef9 thu\u1eadt<\/strong><\/td>\n<\/tr>\n<\/thead>\n
    T\u1ebf b\u00e0o logic<\/b><\/span><\/td>\n200,448<\/span><\/td>\n<\/tr>\n
    CLB Array<\/b><\/span><\/td>\n22,512<\/span><\/td>\n<\/tr>\n
    Total Block RAM<\/b><\/span><\/td>\n6,048 Kb<\/span><\/td>\n<\/tr>\n
    DSP48 Slices<\/b><\/span><\/td>\n96<\/span><\/td>\n<\/tr>\n
    User I\/Os<\/b><\/span><\/td>\n960<\/span><\/td>\n<\/tr>\n
    \u0110\u00e1nh gi\u00e1 t\u1ed1c \u0111\u1ed9<\/b><\/span><\/td>\n-10<\/span><\/td>\n<\/tr>\n
    C\u1ea5p \u0111\u1ed9 nhi\u1ec7t \u0111\u1ed9<\/b><\/span><\/td>\nC\u00f4ng nghi\u1ec7p (-40\u00b0C \u0111\u1ebfn +100\u00b0C)<\/span><\/td>\n<\/tr>\n
    G\u00f3i<\/b><\/span><\/td>\nFFG1513 (Lead-Free Flip-Chip BGA)<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
    \n

    Why Specify the LX200-10FFG1513I?<\/b><\/span><\/p>\n

    1. Unmatched Logic Consolidation<\/b><\/p>\n

    If you are moving away from multi-FPGA boards to a single-chip solution, the LX200 is the industry standard for Virtex-4 designs. The massive logic-to-I\/O ratio eliminates the latency penalties and board complexity associated with inter-FPGA communication.<\/p>\n

    2. Robust Signal Integrity<\/b><\/p>\n

    The FFG1513 package<\/b> is engineered with a high density of power and ground pins to mitigate Simultaneous Switching Noise (SSN). Even when toggling hundreds of I\/Os at high speeds, the device maintains clean signal eyes and robust noise margins.<\/p>\n

    3. Long-Term Reliability & Compliance<\/b><\/p>\n

    The “FFG” lead-free designation ensures your product meets modern RoHS compliance while the “Industrial” rating provides the necessary overhead for long-lifecycle deployment in telecommunications backbones and ruggedized control systems.<\/p>\n

    \n

    High-Value Applications<\/b><\/span><\/p>\n

      \n
    • \n

      Communications:<\/b> 10G\/40G networking line cards and base station processing.<\/p>\n<\/li>\n

    • \n

      Defense & Aerospace:<\/b> Radar beamforming, UAV signal processing, and secure communication.<\/p>\n<\/li>\n

    • \n

      Scientific Computing:<\/b> ASIC emulation, hardware-in-the-loop (HIL) testing, and genomic sequencing acceleration.<\/p>\n<\/li>\n

    • \n

      Medical:<\/b> Real-time 3D reconstruction for CT and MRI systems.<\/p>\n<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

      Nh\u00e0 s\u1ea3n xu\u1ea5t:<\/strong> Xilinx
      \nT\u1ebf b\u00e0o logic:<\/strong> 200.000 t\u01b0\u01a1ng \u0111\u01b0\u01a1ng
      \n(~184.320 t\u1ebf b\u00e0o logic)
      \nC\u00e1c l\u00e1t c\u1eaft logic:<\/strong> 22,272
      \nB\u1ed9 nh\u1edb RAM t\u00edch h\u1ee3p (eRAM):<\/strong> 4.500 KB (kho\u1ea3ng 250 \u00d7 18 KB RAM kh\u1ed1i)
      \nG\u00f3i:<\/strong> FFG1513 (BGA chip l\u1eadt)
      \nNhi\u1ec7t \u0111\u1ed9 ho\u1ea1t \u0111\u1ed9ng:<\/strong> C\u00f4ng nghi\u1ec7p (-40\u00b0C \u0111\u1ebfn +100\u00b0C)<\/p>","protected":false},"featured_media":6110,"template":"","meta":{"_acf_changed":false,"jetpack_publicize_message":"","jetpack_publicize_feature_enabled":true,"jetpack_social_post_already_shared":false,"jetpack_social_options":{"image_generator_settings":{"template":"highway","default_image_id":0,"font":"","enabled":false},"version":2}},"product_brand":[],"product_cat":[21],"product_tag":[],"class_list":{"0":"post-6683","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-xilinx","8":"first","9":"instock","10":"shipping-taxable","11":"product-type-simple"},"acf":[],"aioseo_notices":[],"jetpack_publicize_connections":[],"_links":{"self":[{"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/product\/6683","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/media\/6110"}],"wp:attachment":[{"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/media?parent=6683"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/product_brand?post=6683"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/product_cat?post=6683"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/product_tag?post=6683"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}