{"id":13070,"date":"2026-08-20T19:27:55","date_gmt":"2026-08-20T11:27:55","guid":{"rendered":"https:\/\/www.lxbchip.com\/?p=13070"},"modified":"2026-08-20T19:27:55","modified_gmt":"2026-08-20T11:27:55","slug":"semi-forecast-global-semiconductor-equipment-sales-hit-165-9-billion-record-in-2026","status":"publish","type":"post","link":"https:\/\/www.lxbchip.com\/vi\/semi-forecast-global-semiconductor-equipment-sales-hit-165-9-billion-record-in-2026\/","title":{"rendered":"D\u1ef1 b\u00e1o c\u1ee7a SEMI: Doanh s\u1ed1 b\u00e1n thi\u1ebft b\u1ecb b\u00e1n d\u1eabn to\u00e0n c\u1ea7u s\u1ebd \u0111\u1ea1t m\u1ee9c k\u1ef7 l\u1ee5c $165,9 t\u1ef7 v\u00e0o n\u0103m 2026"},"content":{"rendered":"

SEMI released its mid\u2011year semiconductor equipment market report in August 2026. Global semiconductor manufacturing equipment revenue will reach USD 165.9 billion in 2026, a 23.2% year\u2011on\u2011year increase and hitting all\u2011time high record. The growth momentum will continue through 2028, and total market size is expected to reach USD 229.5 billion.<\/p>\n

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High\u2011end fab equipment delivery lead times keep extending, some core equipment lead\u2011time stretch over 18 months. Meanwhile, semiconductor equipment components face widespread price increases across the whole supply chain. Fab capacity expansion cycles last 12\u201118 months, and component supply cannot keep pace with fast\u2011growing chip manufacturing demand. More chip manufacturers are accelerating component localization projects to ease supply risks.<\/p>\n

AI chip production expansion remains the main driving force for equipment investment. Foundries and memory manufacturers keep raising capital expenditure to meet huge demand from cloud AI servers and edge\u2011AI hardware.<\/p>","protected":false},"excerpt":{"rendered":"

SEMI released its mid\u2011year semiconductor equipment market report in August 2026. Global semiconductor manufacturing equipment revenue will reach USD 165.9<\/p>","protected":false},"author":1,"featured_media":13071,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[1],"tags":[362,363,361,360],"class_list":["post-13070","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-chip-manufacturing","tag-fab-capacity","tag-semi-report","tag-semiconductor-equipment"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/posts\/13070","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/comments?post=13070"}],"version-history":[{"count":0,"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/posts\/13070\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/media\/13071"}],"wp:attachment":[{"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/media?parent=13070"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/categories?post=13070"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.lxbchip.com\/vi\/wp-json\/wp\/v2\/tags?post=13070"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}