Starting July 1, 2026, more than 20 global semiconductor giants including Infineon, Texas Instruments, STMicroelectronics, ON Semiconductor, ADI and domestic power semiconductor leaders officially launched the second round of price increases within this year. Driven by soaring silicon wafer, packaging, special gas and metal raw material costs, plus massive occupation of 8-inch mature wafer capacity by AI server power chips, the delivery cycle of automotive-grade IGBT, SiC MOSFET, industrial op-amps and automotive MCUs has been extended to 30 weeks or longer on average.<\/p>\n
TI rolled out its fourth price adjustment in 12 months, with server PMIC and high-speed signal chain ICs surging 15%\u201385%; Infineon raised silicon-based IGBT and high-voltage MOSFET prices by 5%\u201315%; domestic manufacturers such as StarSem and Yangjie Technology lifted the quotation of full-series power devices by 15%\u201325%. Most authorized distributors only receive monthly limited quota from factories, and bulk orders from medium and small manufacturers cannot be scheduled until early 2027.<\/p>\n
Facing the dual pressure of price inflation and ultra-long lead times, LXBCHIP locked a large batch of brand-new original sealed inventory before the official price hike window. We maintain fixed pre-adjustment pricing without temporary premium, covering full lines of TI, NXP, ADI, Infineon and ON power & analog components. We support same-day sample shipment, split batch delivery for mass production and one-stop BOM kitting service, effectively helping global electronics manufacturers bypass factory order queues and extra cost losses.<\/p>","protected":false},"excerpt":{"rendered":"
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