| MODEL P / N | SERI | JUMLAH LABORATORIUM/CLBS | TINGKAT KECEPATAN | JUMLAH ELEMEN / SEL LOGIKA | TOTAL BIT RAM | JUMLAH I / O | TEGANGAN - PASOKAN | JENIS PEMASANGAN | SUHU PENGOPERASIAN | PAKET / KASUS | PAKET PERANGKAT PEMASOK |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX60-10FFG668C | Virtex-4 LX | 6.656,00 | -10,00 | 59 904 LE | 2 949 120 bit | 448 | 1,14 V ~ 1,26 V | Pemasangan di Permukaan | Komersial (0°C ~ +85°C) | 668-BBGA, FCBGA | 668-FCBGA (27×27) |
XC4VLX60-10FFG668C: Logic-Dense Virtex-4 LX for Established Systems
The XC4VLX60-10FFG668C is a mid-to-high density member of the Xilinx Virtex-4 LX family. With nearly 60,000 logic cells, this FPGA was designed as a logic-optimized workhorse, providing a massive amount of fabric for complex state machines, high-speed bus arbitration, and data-path management without the added cost or power overhead of the embedded PowerPC cores found in the FX series.
Utilizing the FFG668 package (a 1.0mm pitch Flip-Chip BGA), the LX60 offers a high I/O-to-logic ratio, making it an ideal component for medical imaging, telecommunications infrastructure, and high-end industrial control units.
Core Technical Parameters
Sel Logika: 59,904
CLB Array: 64 x 96
Total Block RAM: 2,880 Kb (160 blocks)
DSP48 Slices: 64
Maximum User I/O: 448
Paket: FFG668 (27mm x 27mm, 1.0mm pitch, Lead-Free/RoHS)
Tingkat Kecepatan: -10
Suhu Pengoperasian: Komersial (0°C hingga +85°C)
Engineering Design & Integration Notes
1. Power Supply and Thermal Profile
The 90nm process of the Virtex-4 LX60 requires a 1.2V $V_{CCINT}$ core voltage. Because of the density (nearly 60k logic cells), static power consumption (leakage) can be higher than modern 7-series parts. Ensure your thermal solution—whether passive heatsinking or forced air—is characterized for your specific toggle rates. Even at the -10 speed grade, localized “hot spots” on the die can occur during high-utilization logic switching.
2. Signal Integrity and SelectIO
The 448 user I/Os are organized into multiple banks supporting a wide array of standards (LVDS, SSTL, HSTL, etc.). When maintaining or repairing existing PCBs, ensure the $V_{CCO}$ rails match the banking rules in your original .ucf or .xdc constraint files. The FFG668 flip-chip package is designed for low-inductance power delivery, but proper bypass capacitor placement near the BGA footprint remains critical for high-speed signal integrity.
3. Software Environment (ISE vs. Vivado)
It is important to remember that the Virtex-4 family is not supported by Vivado. You must use Xilinx ISE Design Suite (version 14.7) for synthesis and bitstream generation. If you are retrieving an old project, ensure your timing constraints are updated to account for the -10 speed grade specific propagation delays ($T_{ILO}$, $T_{AS}$, etc.).
Comparison: Virtex-4 LX60 vs. LX40 (FFG668)
| Fitur | XC4VLX60-10FFG668C | XC4VLX40-10FFG668C |
| Sel Logika | 59,904 | 41,472 |
| BRAM (Kb) | 2,880 | 1,728 |
| Max User I/O | 448 | 448 |
| Footprint Compatibility | Ya. | Ya. |
Hardware Engineer’s FAQ
Can I use the XC4VLX60-10FFG668C as a replacement for the -10FF668 (Leaded) version?
Yes, but with one caveat: the “G” in FFG668 indicates a Lead-Free package. While functionally and pin-compatible, the reflow profile for the FFG (RoHS) package is higher than the leaded version. Ensure your assembly line adjusts for SAC305 or similar lead-free solder profiles.
Is this part interchangeable with the ‘I’ (Industrial) grade?
No, not strictly. You can use an ‘I’ grade part to replace this ‘C’ grade part (as it has a wider temperature range), but you should not replace an ‘I’ grade part with this ‘C’ grade part in environments exceeding 85°C.
What is the status of the silicon stepping?
As this is a mature product, we supply the final production steppings which have resolved earlier errata regarding DCM (Digital Clock Manager) jitter and configuration sequence issues found in initial Rev 0/1 silicon.
Need a technical quote or a verified datasheet for the LX60?
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