{"id":6662,"date":"2025-11-18T16:33:30","date_gmt":"2025-11-18T08:33:30","guid":{"rendered":"https:\/\/www.lxbchip.com\/?post_type=product&p=6662"},"modified":"2026-02-02T19:39:50","modified_gmt":"2026-02-02T11:39:50","slug":"xc4vlx100-10ff1148c","status":"publish","type":"product","link":"https:\/\/www.lxbchip.com\/es\/products\/xc4vlx100-10ff1148c\/","title":{"rendered":"XC4VLX100-10FF1148C"},"content":{"rendered":"\n\n\n\n\n
MODELO P\/N<\/th>\nSERIE<\/th>\nN\u00daMERO DE LABORATORIOS\/CLBS<\/th>\nGRADO DE VELOCIDAD<\/th>\nN\u00daMERO DE ELEMENTOS L\u00d3GICOS \/ CELDAS<\/th>\nTOTAL BITS RAM<\/th>\nN\u00daMERO DE E\/S<\/th>\nTENSI\u00d3N - ALIMENTACI\u00d3N<\/th>\nTIPO DE MONTAJE<\/th>\nTEMPERATURA DE FUNCIONAMIENTO<\/th>\nPAQUETE \/ ESTUCHE<\/th>\nPAQUETE DEL DISPOSITIVO DEL PROVEEDOR<\/th>\n<\/tr>\n<\/thead>\n
XC4VLX100-10FF1148C<\/td>\nVirtex-4 LX<\/td>\n11.520,00<\/td>\n-10,00<\/td>\n99840<\/td>\n4478976<\/td>\n768<\/td>\n1,14 V ~ 1,26 V<\/td>\nMontaje en superficie<\/td>\n0 \u00b0C ~ +85 \u00b0C (uso comercial)<\/td>\n1148-BBGA (FCBGA)<\/td>\n1148-FCBGA<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

XC4VLX100-10FF1148C: High-Density Logic Consolidation for Commercial Computing Platforms<\/b><\/span><\/p>\n

En XC4VLX100-10FF1148C<\/b> is a high-capacity FPGA within Xilinx\u2019s legendary Virtex\u00ae-4 LX family, specifically engineered for logic-intensive commercial applications. Utilizing the revolutionary 90nm ASMBL\u2122 (Advanced Silicon Modular Block)<\/b> architecture, this device provides a massive 110,592 Logic Cell<\/b> fabric. It is the definitive choice for architects who need to consolidate complex system-level functions\u2014such as multiple soft-core processors, high-bandwidth memory controllers, and extensive custom RTL\u2014into a single, high-reliability silicon footprint.<\/p>\n

Operating at a Commercial-grade (0\u00b0C to +85\u00b0C)<\/b> temperature range with a -10 grados de pendiente<\/b>, it offers a balanced solution for high-end digital signal processing and massive parallel data routing.<\/p>\n

Core Engineering Highlights<\/b><\/span><\/p>\n

    \n
  • \n

    Architectural Efficiency:<\/b> The ASMBL architecture allows for a highly uniform distribution of logic, memory, and DSP columns. This reduces routing congestion, a critical advantage when designing high-utilization systems that exceed 80% logic occupancy.<\/p>\n<\/li>\n

  • \n

    Rich Memory Hierarchy:<\/b> Caracter\u00edsticas 4,320 Kb of Block RAM (BRAM)<\/b>. This dual-port memory resources are essential for implementing deep data buffers, localized caching, and high-speed FIFO structures required in streaming video or networking applications.<\/p>\n<\/li>\n

  • \n

    Massive I\/O Connectivity:<\/b> Housed in the FF1148 Flip-Chip BGA<\/b> package, the device breaks out 768 E\/S de usuario<\/b>. This allows for the simultaneous management of high-width parallel buses, such as dual-bank DDR2 or QDR-II interfaces, without pin-count bottlenecks.<\/p>\n<\/li>\n

  • \n

    XtremeDSP\u2122 Performance:<\/b> Integrated with 96 dedicated DSP48 slices<\/b>. These hard-coded arithmetic blocks handle 18×18 bit multiplications and MAC functions at hardware speeds, freeing up standard logic for control plane tasks.<\/p>\n<\/li>\n

  • \n

    Precision Clocking (DCM):<\/b> Equipped with advanced Digital Clock Managers<\/b> for sub-nanosecond skew control and frequency synthesis, ensuring stable synchronization across complex, multi-clock domain designs.<\/p>\n<\/li>\n<\/ul>\n

    \n

    Technical Specification Matrix<\/b><\/span><\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n
    Caracter\u00edstica<\/strong><\/td>\nEspecificaci\u00f3n<\/strong><\/td>\n<\/tr>\n<\/thead>\n
    C\u00e9lulas l\u00f3gicas<\/b><\/span><\/td>\n110,592<\/span><\/td>\n<\/tr>\n
    Matriz CLB<\/b><\/span><\/td>\n12,480<\/span><\/td>\n<\/tr>\n
    Bloque total RAM<\/b><\/span><\/td>\n4 320 Kb<\/span><\/td>\n<\/tr>\n
    DSP48 Slices<\/b><\/span><\/td>\n96<\/span><\/td>\n<\/tr>\n
    User I\/Os<\/b><\/span><\/td>\n768<\/span><\/td>\n<\/tr>\n
    Grado de velocidad<\/b><\/span><\/td>\n-10 (Rendimiento est\u00e1ndar)<\/span><\/td>\n<\/tr>\n
    Grado de temperatura<\/b><\/span><\/td>\nComercial (0\u00b0C a +85\u00b0C)<\/span><\/td>\n<\/tr>\n
    Paquete<\/b><\/span><\/td>\nFF1148 (BGA con chip invertido)<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
    \n

    Hardware Architect\u2019s Perspective: Why Specify the LX100-10C?<\/b><\/span><\/p>\n

    1. Predictable Timing Closure<\/b><\/p>\n

    One of the primary reasons engineers stay with the Virtex-4 LX100 is its predictable routing fabric. Unlike newer, more congested architectures, the LX100 provides consistent timing models that allow for faster design iterations and “right-the-first-time” silicon behavior.<\/p>\n

    2. Superior Signal Integrity<\/b><\/p>\n

    En FF1148 Flip-Chip package<\/b> is specifically designed to minimize parasitic inductance. With a dense distribution of VCC and GND pins, it suppresses Simultaneous Switching Noise (SSN)<\/b>, ensuring clean signal eyes for high-speed differential pairs (LVDS\/HSTL).<\/p>\n

    3. Maturity and Stability<\/b><\/p>\n

    For commercial products with long lifecycles\u2014such as medical imaging backplanes or high-end broadcasting gear\u2014the LX100-10C offers a proven track record of field reliability and a well-documented toolchain, reducing the risk of unexpected architectural bugs.<\/p>\n

    \n

    Ideal Use Cases<\/b><\/span><\/p>\n

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    • \n

      Broadcasting:<\/b> Real-time format conversion and professional-grade video switching.<\/p>\n<\/li>\n

    • \n

      Medical Systems:<\/b> Advanced MRI data acquisition and real-time image reconstruction.<\/p>\n<\/li>\n

    • \n

      Pruebas y mediciones:<\/b> Logic analyzer front-ends and high-speed pattern generation.<\/p>\n<\/li>\n

    • \n

      Communications:<\/b> High-speed protocol conversion and localized switching fabrics.<\/p>\n<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

      Fabricante:<\/strong> Xilinx
      \nC\u00e9lulas l\u00f3gicas:<\/strong> 110,592
      \nRebanadas l\u00f3gicas:<\/strong> 49,152 (approx)
      \nRAM integrada (eRAM):<\/strong> 4.320 Kb (240 \u00d7 18Kb Bloque RAM)
      \nPaquete:<\/strong> FF1148 (Fine-Pitch BGA)
      \nTemperatura de funcionamiento:<\/strong> Comercial (0\u00b0C a +85\u00b0C)<\/p>","protected":false},"featured_media":6090,"template":"","meta":{"_acf_changed":false},"product_brand":[],"product_cat":[21],"product_tag":[],"class_list":["post-6662","product","type-product","status-publish","has-post-thumbnail","product_cat-xilinx","first","instock","shipping-taxable","product-type-simple"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.lxbchip.com\/es\/wp-json\/wp\/v2\/product\/6662","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lxbchip.com\/es\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.lxbchip.com\/es\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lxbchip.com\/es\/wp-json\/wp\/v2\/media\/6090"}],"wp:attachment":[{"href":"https:\/\/www.lxbchip.com\/es\/wp-json\/wp\/v2\/media?parent=6662"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.lxbchip.com\/es\/wp-json\/wp\/v2\/product_brand?post=6662"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.lxbchip.com\/es\/wp-json\/wp\/v2\/product_cat?post=6662"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.lxbchip.com\/es\/wp-json\/wp\/v2\/product_tag?post=6662"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}