{"id":6684,"date":"2025-11-18T20:09:30","date_gmt":"2025-11-18T12:09:30","guid":{"rendered":"https:\/\/www.lxbchip.com\/?post_type=product&p=6684"},"modified":"2026-02-02T19:21:04","modified_gmt":"2026-02-02T11:21:04","slug":"xc4vlx200-11ffg1513c","status":"publish","type":"product","link":"https:\/\/www.lxbchip.com\/de\/products\/xc4vlx200-11ffg1513c\/","title":{"rendered":"XC4VLX200-11FFG1513C"},"content":{"rendered":"\n\n\n\n\n
MODELL P\/N<\/th>\nSERIE<\/th>\nANZAHL DER LABORE\/KLINIKEN<\/th>\nGESCHWINDIGKEITSSTUFE<\/th>\nANZAHL DER LOGIKELEMENTE \/ ZELLEN<\/th>\nRAM-BITS INSGESAMT<\/th>\nANZAHL DER E\/A<\/th>\nSPANNUNG - VERSORGUNG<\/th>\nBEFESTIGUNGSTYP<\/th>\nBETRIEBSTEMPERATUR<\/th>\nVERPACKUNG \/ KASSE<\/th>\nLIEFERANT GER\u00c4TEPAKET<\/th>\n<\/tr>\n<\/thead>\n
XC4VLX200-11FFG1513C<\/td>\nVirtex-4 LX<\/td>\n22.272,00<\/td>\n-11,00<\/td>\n200448<\/td>\n6193152<\/td>\n960<\/td>\n1,14 V ~ 1,26 V<\/td>\nOberfl\u00e4chenmontage<\/td>\n0 \u00b0C ~ +85 \u00b0C (Commercial)<\/td>\n1513-BBGA (FCBGA)<\/td>\n1513-FCBGA<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

XC4VLX200-11FFG1513C: The Performance Pinnacle of High-Density Logic Integration<\/b><\/span><\/p>\n

Die XC4VLX200-11FFG1513C<\/b> is the highest-specification, high-density FPGA in the Xilinx Virtex\u00ae-4 LX family. Built on the 90nm ASMBL\u2122 (Advanced Silicon Modular Block)<\/b> architecture, this device is engineered for architects who require the absolute maximum logic capacity paired with the superior -11 speed grade<\/b>. It is the industry-standard choice for complex, logic-heavy applications where timing closure and single-chip integration are critical.<\/p>\n

Featuring a staggering 200,448 Logic Cells<\/b> and the fastest commercial speed grade, the LX200-11 is designed to push the boundaries of real-time data processing and large-scale system emulation.<\/p>\n

Key Engineering Advantages<\/b><\/span><\/p>\n

    \n
  • \n

    Fastest Timing Closure (-11 Speed Grade):<\/b> The -11 speed grade is essential for high-performance designs, providing a significant frequency boost over the standard -10 models. This extra headroom is vital for stabilizing 300MHz+ internal logic fabrics and high-speed memory interfaces.<\/p>\n<\/li>\n

  • \n

    Massive Logic Consolidation:<\/b> With over 200k logic cells, this FPGA allows for the integration of entire multi-processor systems, complex encryption engines, and massive state machines into a single die, eliminating the latency and complexity of multi-chip partitioning.<\/p>\n<\/li>\n

  • \n

    Unrivaled I\/O Capacity:<\/b> Housed in the FFG1513<\/b> package, the device provides 960 User I\/Os<\/b>. This allows for massive parallel throughput, easily supporting multiple wide-bus interfaces like DDR2\/QDR-II and high-speed backplane protocols.<\/p>\n<\/li>\n

  • \n

    High-Performance DSP & Memory:<\/b> Includes 6,048 Kb of Block RAM<\/b> und 96 XtremeDSP\u2122 slices<\/b>. The combination of dense memory and dedicated arithmetic hardware makes it a powerhouse for real-time signal processing and 4K video algorithms.<\/p>\n<\/li>\n

  • \n

    RoHS Compliant Flip-Chip Packaging:<\/b> Die FFG1513<\/b> package is optimized for both environmental compliance and thermal integrity. Its design ensures low-inductance power delivery and superior heat dissipation, even at high switching frequencies.<\/p>\n<\/li>\n<\/ul>\n

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    Technical Specification Matrix<\/b><\/span><\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n
    Merkmal<\/strong><\/td>\nSpezifikation<\/strong><\/td>\n<\/tr>\n<\/thead>\n
    Logische Zellen<\/b><\/span><\/td>\n200,448<\/span><\/td>\n<\/tr>\n
    CLB Array<\/b><\/span><\/td>\n22,512<\/span><\/td>\n<\/tr>\n
    Total Block RAM<\/b><\/span><\/td>\n6,048 Kb<\/span><\/td>\n<\/tr>\n
    DSP48 Slices<\/b><\/span><\/td>\n96<\/span><\/td>\n<\/tr>\n
    Max User I\/O<\/b><\/span><\/td>\n960<\/span><\/td>\n<\/tr>\n
    Geschwindigkeitsstufe<\/b><\/span><\/td>\n-11 (High Performance)<\/span><\/td>\n<\/tr>\n
    Temperatur Grad<\/b><\/span><\/td>\nHandels\u00fcblich (0\u00b0C bis +85\u00b0C)<\/span><\/td>\n<\/tr>\n
    Paket<\/b><\/span><\/td>\nFFG1513 (Lead-Free \/ 1.0mm Pitch)<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
    \n

    Why Specify the LX200-11C?<\/b><\/span><\/p>\n

    1. Solving the Routing Congestion Challenge<\/b><\/p>\n

    In many high-density designs, routing congestion can kill timing. The Virtex-4 ASMBL architecture in the LX200 ensures a highly uniform distribution of logic, memory, and I\/O. Combined with the -11 speed grade<\/b>, this allows for much easier timing closure on designs that utilize 85% or more of the available logic resources.<\/p>\n

    2. Signal Integrity at Scale<\/b><\/p>\n

    Driving nearly 1,000 I\/Os simultaneously requires a robust power distribution network. The FFG1513 package is specifically designed with an extensive array of VCC and GND pins to suppress Simultaneous Switching Noise (SSN)<\/b>, ensuring clean signal eyes for high-speed differential and single-ended signaling.<\/p>\n

    3. Long-Lifecycle Stability<\/b><\/p>\n

    The LX200-11C is a proven, mature platform. For mission-critical commercial systems\u2014such as high-end medical scanners or broadcasting switchers\u2014the stability of the Virtex-4 toolchain and the known reliability of the 90nm process provide a low-risk path to production.<\/p>\n

    \n

    Ziel-Anwendungen<\/b><\/span><\/p>\n

      \n
    • \n

      ASIC\/SoC Prototyping:<\/b> Large-scale logic verification and pre-silicon emulation.<\/p>\n<\/li>\n

    • \n

      Professional Video Gear:<\/b> Real-time 8K\/4K image reconstruction and conversion.<\/p>\n<\/li>\n

    • \n

      Telecommunications:<\/b> High-bandwidth switching fabrics and protocol acceleration.<\/p>\n<\/li>\n

    • \n

      Advanced Instrumentation:<\/b> High-speed data acquisition and real-time analysis for scientific research.<\/p>\n<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

      Hersteller:<\/strong> Xilinx
      \nLogische Zellen:<\/strong> 178,176?(~200K system gates)
      \nLogische Schnitte:<\/strong> 22,272
      \nEingebettetes RAM (eRAM):<\/strong> 6,193 Kb (~336 \u00d7 18Kb Block RAM)
      \nPaket:<\/strong> FFG1513 (Flip?Chip BGA)
      \nBetriebstemperatur:<\/strong> Handels\u00fcblich (0\u00b0C bis +85\u00b0C)<\/p>","protected":false},"featured_media":6111,"template":"","meta":{"_acf_changed":false,"jetpack_publicize_message":"","jetpack_publicize_feature_enabled":true,"jetpack_social_post_already_shared":false,"jetpack_social_options":{"image_generator_settings":{"template":"highway","default_image_id":0,"font":"","enabled":false},"version":2}},"product_brand":[],"product_cat":[21],"product_tag":[],"class_list":{"0":"post-6684","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-xilinx","8":"first","9":"instock","10":"shipping-taxable","11":"product-type-simple"},"acf":[],"aioseo_notices":[],"jetpack_publicize_connections":[],"_links":{"self":[{"href":"https:\/\/www.lxbchip.com\/de\/wp-json\/wp\/v2\/product\/6684","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lxbchip.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.lxbchip.com\/de\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lxbchip.com\/de\/wp-json\/wp\/v2\/media\/6111"}],"wp:attachment":[{"href":"https:\/\/www.lxbchip.com\/de\/wp-json\/wp\/v2\/media?parent=6684"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.lxbchip.com\/de\/wp-json\/wp\/v2\/product_brand?post=6684"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.lxbchip.com\/de\/wp-json\/wp\/v2\/product_cat?post=6684"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.lxbchip.com\/de\/wp-json\/wp\/v2\/product_tag?post=6684"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}