xc4vsx35-10ffg668i

الشركة المصنعة: AMD / Xilinx
الخلايا المنطقية: 55,296
شرائح المنطق: 6,144
ذاكرة الوصول العشوائي المدمجة (eRAM): 5,898,240 بت
الحزمة: FCPBBGA-1148 (27 × 27 مم)
درجة حرارة التشغيل:من 40 درجة مئوية إلى +100 درجة مئوية (صناعي)

أرسل لنا رسالة

    المواصفات

    الطراز P/Nالسلسلةعدد المعامل/المختبراتدرجة السرعةعدد العناصر/الخلايا المنطقيةإجمالي بتات ذاكرة الوصول العشوائي (RAM)عدد الإدخال/الإخراجالجهد - الإمدادنوع التركيبدرجة حرارة التشغيلالعبوة / العلبةحزمة جهاز المورد
    xc4vsx35-10ffg668iVirtex-4 SX4,36-10,0034,848 خلية منطقية3,168 كيلوبايت3201.14 فولت ~ 1.26 فولتSMDصناعي (-40 درجة مئوية إلى +100 درجة مئوية تحت الصفر)668-BGAFFG668

    XC4VSX35-10FFG668I Xilinx Virtex-4 SX FPGA – Industrial Grade DSP Processing Device

    إن xc4vsx35-10ffg668i is a DSP-oriented FPGA from the Xilinx Virtex-4 SX family, designed for applications that require stable real-time signal processing and operation across extended temperature ranges.

    Unlike general-purpose logic-focused devices, the Virtex-4 SX series is optimized around DSP48 slices, making this part especially suitable for filtering, modulation, FFT acceleration, and other compute-heavy data path workloads. The industrial temperature rating and compact FFG668 package make it a practical choice for embedded and industrial platforms with limited board space.

    Key Specifications Overview

    • Part Number: xc4vsx35-10ffg668i

    • عائلة FPGA: Xilinx Virtex-4 SX Series

    • درجة السرعة: -10

    • نوع العبوة: FFG668 Flip-Chip BGA

    • Temperature Grade: Industrial (-40°C to +100°C junction)

    • DSP Resources: Integrated DSP48 slices for high-throughput processing

    • Target Workload: Signal processing and data-intensive applications

    التطبيقات النموذجية

    In real engineering projects, the XC4VSX35-10FFG668I is commonly deployed in:

    • Industrial communication equipment

    • منصات الراديو المعرفة بالبرمجيات (SDR)

    • Data acquisition and measurement systems

    • Machine vision and industrial imaging

    • Motion control and automation controllers

    • Embedded video processing modules

    This device is usually selected when DSP performance and thermal reliability are more critical than maximum logic density.

    Design and Integration Considerations

    The FFG668 package provides a balanced I/O count that supports external memory interfaces, parallel ADC/DAC connections, and multiple high-speed peripheral buses while keeping PCB complexity under control.

    Virtex-4 remains a mature FPGA platform with stable tool support and well-documented design resources. For legacy system maintenance and long-term industrial products, this part offers predictable behavior and consistent performance across temperature extremes.

    Supply Status and Procurement Notes

    The XC4VSX35-10FFG668I is classified as a legacy FPGA device, and availability depends on specialized inventory channels and long-term stock programs.

    When sourcing this part, engineers and procurement teams typically check:

    • Original manufacturer packaging and labeling

    • Date code and lot traceability

    • Industrial temperature marking

    • Moisture sensitivity level (MSL) compliance

    • Proper storage and handling conditions

    Early sourcing is recommended for production programs and maintenance projects to avoid unexpected lead-time issues.

    📩 للتواصل مع LXB Semicon for availability, pricing, and technical support.