xc4vlx160-10ff1148i

الشركة المصنعة: زيلينكس
الخلايا المنطقية: 152,064
شرائح المنطق: 67,584
ذاكرة الوصول العشوائي المدمجة (eRAM): 5,184 Kb (288 × 18Kb Block RAM)
الحزمة: FF1148 (Fine?Pitch BGA)
درجة حرارة التشغيل: صناعي (-40 درجة مئوية إلى +100 درجة مئوية)

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    المواصفات

    الطراز P/Nالسلسلةعدد المعامل/المختبراتدرجة السرعةعدد العناصر/الخلايا المنطقيةإجمالي بتات ذاكرة الوصول العشوائي (RAM)عدد الإدخال/الإخراجالجهد - الإمدادنوع التركيبدرجة حرارة التشغيلالعبوة / العلبةحزمة جهاز المورد
    xc4vlx160-10ff1148iVirtex-4 LX16.896,00-10,00152064LE5308416 بت7681.14 فولت ~ 1.26 فولتالتركيب على السطحصناعي (-40 درجة مئوية إلى +100 درجة مئوية تحت الصفر)1148-BBGA, FCBGA, 1148-BBGA1148-FCPCPBBGA (35×35)

    XC4VLX160-10FF1148I: Industrial-Grade Systems

    إن xc4vlx160-10ff1148i stands as a cornerstone of the Xilinx Virtex-4 LX family, engineered specifically for high-performance logic applications. Built on the innovative ASMBL (Advanced Silicon Modular Block) architecture, this FPGA delivers an optimal balance of logic density, power efficiency, and signal integrity for complex digital systems.

    Key Performance Highlights

    • Massive Logic Capacity: With 152,064 Logic Cells and over 17,000 CLBs, the LX160 is designed to handle high-utilization designs—from massive state machines to complex data processing pipelines—without compromising on routing congestion.

    • Robust Memory & DSP Resources: الميزات 5,184 Kb of dedicated Block RAM, providing the low-latency buffering required for high-speed data throughput. The integration of 96 DSP48 slices allows for efficient implementation of arithmetic-intensive tasks like filtering and digital modulation.

    • Advanced I/O Flexibility: إن FF1148 Flip-Chip BGA package breaks out 768 functional I/Os. Leveraging Xilinx’s SelectIO technology, this device supports a wide array of differential and single-ended signaling standards, ensuring seamless interface with high-speed ADCs, DACs, and memory controllers.

    • Precision Clock Management: Equipped with hard-IP Digital Clock Managers (DCMs), the LX160 offers sophisticated phase shifting, frequency synthesis, and jitter reduction, ensuring global clock synchronization across massive logic arrays.

    Technical Specifications

    الميزةالمواصفات
    الخلايا المنطقية152,064
    Total Block RAM5,184 Kb
    DSP48 Slices96
    Max User I/O768
    درجة السرعة-10
    درجة حرارة التشغيلIndustrial (-40°C to +100°C Tj)
    الحزمةFlip-Chip BGA (FF1148)
    الجهد الأساسي1.2V

    Engineering Perspective: Why Source the LX160 Today?

    While newer nodes exist, the XC4VLX160 remains a critical component for long-lifecycle industrial and aerospace platforms. Its 90nm process provides a level of electrical robustness and maturity that is often preferred for “legacy-plus” designs.

    • Reliability: The Industrial-grade rating (-40°C to +100°C) ensures stable timing closure even in harsh thermal environments.

    • Stability: The FF1148 package is specifically designed for superior thermal dissipation and reduced Simultaneous Switching Noise (SSN), making it a reliable choice for high-speed parallel bus architectures.

    • Ecosystem: Supported by mature development tools, allowing for rapid deployment in existing system architectures without the overhead of migrating to newer, more volatile software environments.

    التطبيقات

    • High-speed Data Acquisition & Instrumentation

    • Industrial Automation & Control Systems

    • Aerospace and Defense Signal Processing

    • Legacy System Maintenance and Life Extension Programs